12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- UCIe based Ka/Ku band transceiver
- Wide Bandwidth
- Scalable solution for dense mm-wave radio into single multi-chip modules
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Interconnect Chiplet
- Integrates 16 complete UCIe modules, following the standard UCIe 1.1 standard
- Integrates one complete HBM3 IP, including the controller and PHY, following the HBM3 JESD238 standard
Direct Chiplet Interface
- This device will enable CrossFire customers that have integrated DCI connectivity into their Chiplets to connect to Chiplets equipped with the standard high power, low density UCIe interface.
HBM3e Advanced-packaging chiplet for all workloads
- Scalable AI, fortified with high compute density and ample memory bandwidth
High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
UCIe based 8-bit 48-Gsps Transceiver
- 48-Gsps peak sample rate
- 8 bit resolution
- UCIe SP (16x lanes at 16Gbps) with streaming controller
UCIe based 12-bit 12-Gsps Transceiver
- 12-Gsps peak sample rate
- 12 bit resolution (programmable)
- UCIe SP (16x lanes at 16Gbps) with streaming controller
Parallel Single Mode (PSM) 16-channel 112 Gbps Transmitter Chiplet
- 16x DR4 specification compliant transmit channels including modulator and driver
- Digital SPI control interface
Active silicon interposer
- Network-On-Interposer
- 4 Tbps aggregate bisection bandwidth
Featured News
HyperLight利用其TFLN Chiplet ™ 平台推出创下Vπ新低纪录的110GHz强度调制器
2025-03-25T20:03:00+01:00
GUC 宣布成功推出业界首款采用台积电 3nm 和 CoWoS 技术的 UCIe 32G 芯片
2025-03-13T07:52:00+01:00
凭借智能 NoC IP - FlexGen，Arteris革新半导体设计，带来全面升级的生产率和结果质量
2025-02-19T08:58:00+01:00
乾瞻科技宣布最新UCIe IP设计定案，推动高速传输技术突破
2025-01-16T09:44:00+01:00
盛合晶微完成7億美元新增定向融資，耐心資本助力三維多芯片集成技術龍頭
2025-01-02T11:18:00+01:00
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HyperLight利用其TFLN Chiplet ™ 平台推出创下Vπ新低纪录的110GHz强度调制器
2025-03-25T20:03:00+01:00
GUC 宣布成功推出业界首款采用台积电 3nm 和 CoWoS 技术的 UCIe 32G 芯片
2025-03-13T07:52:00+01:00
凭借智能 NoC IP - FlexGen，Arteris革新半导体设计，带来全面升级的生产率和结果质量
2025-02-19T08:58:00+01:00
乾瞻科技宣布最新UCIe IP设计定案，推动高速传输技术突破
2025-01-16T09:44:00+01:00
盛合晶微完成7億美元新增定向融資，耐心資本助力三維多芯片集成技術龍頭
2025-01-02T11:18:00+01:00
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